Researchers at MIT, UT San Antonio and Notre Dame are collaborating with Internet2 and Rackspace Hosting to build a new OpenStack-optimized hybrid cloud environment designed to help the research and education community use the cloud for big data research.
Intel has rolled out its new Intel HPC Distribution for Apache Hadoop software, an enterprise-grade solution designed for storing and processing large data sets.
The San Diego Supercomputer Center at the University of California, San Diego is deploying Comet, a virtualized petascale supercomputer to address the needs of "the 99 percent."
The Center for Environmental Implications of NanoTechnology, a multi-institutional research center headquartered at Duke University's Pratt School of Engineering, has won a $15 million grant renewal from the National Science Foundation and the United States Environmental Protection Agency.
University of Michigan is preparing for a new project, called REBUILD, which aims to improve STEM education with implementation of evidence-based teaching practices.
Cornell University has become the 13th member of the Jet Propulsion Laboratory's Strategic University Research Partnership program. SURP provides support for summer internships for undergraduate students and collaborative research and educational opportunities.
A community college in Cleveland, OH has just begun testing a new interactive 3D simulation intended to help its students learn how stress affects the body.
The San Diego Supercomputer Center at the University of California, San Diego has partnered with local middle schools to offer a series of computer science workshops aimed at getting more female and minority students interested in computing.
The Curry School of Education and the School of Engineering and Applied Science at the University of Virginia have launched a new lab school that puts digital fabrication technologies in the hands of middle schoolers.
A new process for 4D printing integrates "shape memory" polymer fibers into composite materials used in conventional 3D printing.