NEXX Systems Joins 3D Chip Research Program at UAlbany

The 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany in New York has a new participant. Nexx Systems, which manufacturers process equipment for advanced wafer-level packaging, will be participating on research on innovative electrodeposition technology and the development of high yield, low cost copper electroplating solutions that will enable high density 3D through-silicon-vias (TSVs). A TSV is an electrical connection that passes through a silicon wafer or die, enabling chips to be stacked on top of each other, increasing chip functionality and processing power without increasing its footprint.

Launched two years ago by Sematech, a global consortium of chip-makers, the 3D program has been actively engaging with equipment and materials suppliers to ready TSV technology by addressing the infrastructure and development challenges in 3D-TSV.

"We are delighted to welcome Nexx Systems to the UAlbany NanoCollege, where it joins a host of the world's leading high-tech companies engaged in next-generation nanoelectronics research and development," said Richard Brilla, VP for strategy, alliances, and consortia at CNSE. "This new partnership is further evidence that Sematech's expansion at CNSE is paying significant dividends, not only in world-class education and cutting-edge research, but also in economic outreach and growth."

"We all recognize that collaboration among various disciplines across the industry will be required to realize the full potential of 3D," said John Warlaumont, SEMATECH VP of advanced technology. "Nexx's membership is the latest example of this new collaborative model that encourages participation with SEMATECH members in focused, cooperative R&D."

About the Author

Dian Schaffhauser is a former senior contributing editor for 1105 Media's education publications THE Journal, Campus Technology and Spaces4Learning.

Featured

  • interconnected glowing nodes and circuits in blue and green, forming a neural network on a dark background with a futuristic design

    Tech Giants Launch $100 Billion AI Infrastructure Network Project

    OpenAI, SoftBank, and Oracle have unveiled a new venture, Stargate, through which they aim to build a massive AI infrastructure network across the United States. The initiative, which was announced at the White House with President Donald Trump, has been described as the "largest AI infrastructure project in history."

  • futuristic brain made of glowing circuits with a human hand reaching toward it

    Cloud Security Alliance Calls for Rethinking AI Development in the Face of DeepSeek Debut

    The Cloud Security Alliance (CSA) has weighed in on DeepSeek AI’s disruptive debut, warning that the revolutionary AI model is “rewriting the rules” of AI development. The remarks come as cloud security firm Wiz disclosed a major data leak in DeepSeek’s platform, raising concerns about security vulnerabilities in the cutting-edge system.

  • university building surrounded by icons for AI, checklists, and data governance

    Improving AI Governance for Stronger University Compliance and Innovation

    AI can generate valuable insights for higher education institutions and it can be used to enhance the teaching process itself. The caveat is that this can only be achieved when universities adopt a strategic and proactive set of data and process management policies for their use of AI.

  • three main icons—a cloud, a user profile, and a padlock—connected by circuit lines on a blue abstract background

    Report: Identity Has Become a Critical Security Perimeter for Cloud Services

    A new threat landscape report points to new cloud vulnerabilities. According to the 2025 Global Threat Landscape Report from Fortinet, while misconfigured cloud storage buckets were once a prime vector for cybersecurity exploits, other cloud missteps are gaining focus.