NEXX Systems Joins 3D Chip Research Program at UAlbany
- By Dian Schaffhauser
- 02/10/09
The 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany in New York has a new participant. Nexx Systems, which manufacturers process equipment for advanced wafer-level packaging, will be participating on research on innovative electrodeposition technology and the development of high yield, low cost copper electroplating solutions that will enable high density 3D through-silicon-vias (TSVs). A TSV is an electrical connection that passes through a silicon wafer or die, enabling chips to be stacked on top of each other, increasing chip functionality and processing power without increasing its footprint.
Launched two years ago by Sematech, a global consortium of chip-makers, the 3D program has been actively engaging with equipment and materials suppliers to ready TSV technology by addressing the infrastructure and development challenges in 3D-TSV.
"We are delighted to welcome Nexx Systems to the UAlbany NanoCollege, where it joins a host of the world's leading high-tech companies engaged in next-generation nanoelectronics research and development," said Richard Brilla, VP for strategy, alliances, and consortia at CNSE. "This new partnership is further evidence that Sematech's expansion at CNSE is paying significant dividends, not only in world-class education and cutting-edge research, but also in economic outreach and growth."
"We all recognize that collaboration among various disciplines across the industry will be required to realize the full potential of 3D," said John Warlaumont, SEMATECH VP of advanced technology. "Nexx's membership is the latest example of this new collaborative model that encourages participation with SEMATECH members in focused, cooperative R&D."
About the Author
Dian Schaffhauser is a former senior contributing editor for 1105 Media's education publications THE Journal, Campus Technology and Spaces4Learning.